Blogging from Hsinchu: ICCAD and 40nm Process Variation
The International Conference on Computer-Aided Design (ICCAD) has always been my favorite semiconductor design enablement event, the signal-to-noise ratio is the highest in the industry! This year ICCAD is November 2-5th at the Double Tree Hotel in San Jose. ICCAD and I are both celebrating our 25th year serving the semiconductor industry.
Welcome to the 2009 International Conference on Computer-Aided Design (ICCAD), ICCAD continues to be the premier — and most selective — conference devoted to technical innovations in design automation. ICCAD’s program of technical papers, tutorials, keynotes and Monday night panel highlights the most important current and future research challenges. A day of colocated workshops on hot topics promises non-stop technical excitement. And as always, a large number of side meetings and social events provide plenty of opportunities for networking and meeting colleagues and friends. Hamid Pirahesh, IBM Fellow at the Almaden Research Center, will deliver the keynote outlining the role of Cloud Computing and key related challenges which represent opportunities for the ICCAD community.
- 438 worldwide submissions and the technical program committee
- 115 excellent papers for presentation
- 31 sessions over the three days of the technical program.
- 3 special sessions focused on providing additional broad perspectives for our CAD audience.
Other than the keynote, the 2 sessions that most interest me are:
(1) The Future of EDA–A conversation with Jim Hogan and Paul McLellan on what EDA needs to change for 2020 success Monday, November 2, 3:00 - 4:00 p.m. | The Silicon Valley Room.
Knowing both Jim and Paul, expect an entertaining discussion on why EDA sucks.
(2) COLOCATED WORKSHOP: Variability Modeling and Characterization , Thursday, November 05, 8:00am – 5:00pm | Siskiyou
Having spent the week in Taiwan getting schooled on foundry Process Corners versus Design Specific Corners, I’m eager to learn anything and everything about variability and modeling I possibly can. Check out my blogs TSMC 40nm Yield Explained and TSMC Process Variation for additional experiences.
Hsinchu Science and Industrial Park is the Silicon Valley of Taiwan with 300+ semiconductor companies. Also called the Windy City, like Chicago, with winds off the China Sea, monsoons, typhoons, and earthquakes, oh my! This week the winds were 20-30mph which was entertaining to say the least. November-December is a real nice time to be here, warm but not too humid. Hsinchu City has an interesting Wikipidia page, lots of history here.
And yes, I flew the dreaded China Air again ( SFO->TPE round trip for $600), but this is really the last time, really! When the plane lands in Taipei and the seat belt lights go off there is an absolute rugby scrum to get off the plane first. I was on an aisle this time so I stood up and was taken out by a woman twice my age and trampled by another twice my size. Of course the plane door wasn’t even open yet so the scrummers were barely in front of me after the dust settled. Then there was the 20 minute wait for immigration and luggage, which makes no sense to me whatsoever. What’s the hurry? To prevent further deplaning injuries I changed my return seat to my usual window so I can watch the scrum from the sidelines.
Next up: A day with the incredible TSMC Design Ecosystem, should be blog worthy for sure.
Daniel,
As a 25year semiconductor industry veteran working, traveling in Asia I can totally relate to your comments regarding China Air. I have been run over or undercut by little old ladies so many times I cannot recall all of them.
My favorite is when the plane has landed and taxing it’s way to the terminal with the seat belt sign still on. Passengers are up opening over head bins ignoring the flight attendants instructions to remain seated.
So goes the race to the bottom…